CVE-2017-18157 json
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MD…
published 7y ago modified 4mo ago also EUVD-2017-9292
- cvss
- 7.8
- version 3.0, NVD
- cisa kev
- Not listed
- not in CISA's catalog
- epss
- 0.2%
- EPSS 0.2% chance of exploitation in 30 days, percentile 15%
- public exploits
- 0
- none known
Summary
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
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0.24% chance of exploitation in the next 30 days, higher than 15% of all scored CVEs (FIRST EPSS, 2026-11-09).
CVSS scores
| assigned by | version | score | vector |
|---|---|---|---|
| NVD | 3.0 | 7.8 | CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
| NVD | 2.0 | 7.2 | AV:L/AC:L/Au:N/C:C/I:C/A:C |
Affected products
- Qualcomm Technologies, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Classification
- Weakness
-
- CWE-416 Use After Free
References
-
qualcomm.com
/company/product-security/bulletins
vendor-advisory
Sources
- CVE List CVE-2017-18157
- NVD CVE-2017-18157
Fencer Intel keeps one entry per vulnerability: the CVE id wins, then GHSA, and records that alias each other are merged, except that two CVEs always keep separate entries. The same data is available as JSON.